| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent solder resistance, and excellent balance of mold releasability, successive moldability, appearance of the surface of a resin cured product, mold staining and the like at molding, and to provide an electronic component device. SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) an organopolysiloxane (c1) having a polycaprolactone group, and/or a reaction product (c2) of the organopolysiloxane (c1) having the polycaprolactone group with an epoxy resin, and (D) a tri-fatty acid ester of glycerol. Preferably, the weight ratio A<SB>c1</SB>/A<SB>D</SB>of the compounded amount A<SB>c1</SB>of the organopolysiloxane (c1) component having the polycaprolactone group contained in the component (C) to the compounded amount A<SB>D</SB>of the tri-fatty acid ester of the glycerol is (3/1) to (1/5). COPYRIGHT: (C)2008,JPO&INPIT |
