| 摘要 |
PURPOSE: A wafer testing prober is provided to simplify a manufacturing process by not forming an electrode on a semiconductor wafer. CONSTITUTION: A probe unit(110) is contacted with a thin film layer(20) of a semiconductor wafer. The thin film layer includes a light emitting structure with a first semiconductor layer, a second semiconductor layer and an active layer. The probe unit includes at least one of polymer materials or metal particles. A beam unit(120) is connected to a printed circuit board for transmitting an electrical signal to the probe unit. An upper width(d1) of the probe unit is same as a width of the beam unit.
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