| 摘要 |
<p>Binding non-solid, oxidic, inorganic materials with a curable composition, comprises contacting the inorganic materials with a curable composition comprising at least one curable resin and subsequently thermal curing of the resin, where: the resin is an etherified aminoplast resin; the amount of the curable composition is 0.5-60 wt.%, relative to the amount of the inorganic materials; and the curing step is carried out at greater than 0-280[deg] C. An independent claim is included for a solid composition comprising inorganic particles and a cured resin obtained by the above process.</p> |
