发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF ENVELOPING AN INTEGRATED CIRCUIT |
摘要 |
A package of a semiconductor device comprising an integrated circuit ( 10 ) generally comprises an inner layer ( 21 ) and an outer layer ( 16 ), which layers ( 16,21 ) have a mutual interface ( 24 ). An improved stability of the package is realized in that the interface ( 24 ) encloses a delamination area ( 22 ), which area ( 22 ) is isolated from any bond pads ( 18 ) of the integrated circuit ( 10 ). The delamination area ( 22 ) may be created by a pattern-wise activation of a surface of the inner layer ( 21 ). A quantity of a curable polymer may be disposed on this surface to achieve this. |
申请公布号 |
EP1451869(B1) |
申请公布日期 |
2012.07.11 |
申请号 |
EP20020785734 |
申请日期 |
2002.11.20 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
WIJDENES, JACOB |
分类号 |
H01L23/29;H01L23/31;H01L21/56 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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