发明名称 |
WAFER LEVEL PACKAGE STRUCTURE, AND SENSOR DEVICE OBTAINED FROM THE SAME PACKAGE STRUCTURE |
摘要 |
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with plural sensor units, and a pair of package wafers bonded to both surfaces of the semiconductor wafer. Each of the sensor units has a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Since the semiconductor wafer is bonded to each of the package wafers by a solid-phase direct bonding without diffusion between a surface-activated region formed on the frame and a surface-activated region formed on the package wafer, it is possible to prevent that variations in sensor characteristics occur due to residual stress at the bonding interface. |
申请公布号 |
EP1953815(B1) |
申请公布日期 |
2012.07.11 |
申请号 |
EP20060833257 |
申请日期 |
2006.11.24 |
申请人 |
PANASONIC CORPORATION |
发明人 |
OKUDO, TAKAFUMI;SUZUKI, YUJI;TAKEGAWA, YOSHIYUKI;BABA, TORU;GOTOU, KOUJI;MIYAJIMA, HISAKAZU;KATAOKA, KAZUSHI;SAIJO, TAKASHI |
分类号 |
G01P1/02;B81C1/00;G01C19/56;G01P15/08;G01P15/12;G01P15/18 |
主分类号 |
G01P1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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