| 摘要 |
<p>[Object] To provide a method for producing a circuit board structurally characterized in that circuit patterns can be secured to an insulating member having a plate shape with relative positions thereof unchanged, and a circuit board where relative positions of a plurality of circuit patterns remain unchanged. [Solving means] A first coil 30 having the winding number of 1 is formed in a planar shape from a metal plate. Then, a second coil 40 having the winding number of 4 is formed in a planar shape from a metal plate in a manner that end portions 41 and 42 of the second coil 40 on both sides thereof are coupled with other portions adjacent thereto by coupling sections 43 and 44. A pair of the first coil 30 and the second coil 40 is mounted so as to face each other with a resin plate 50, where a plurality of prepregs are stacked in layers, interposed therebetween, and the coupling by the coupling section 43 and the coupling by the coupling section 44 are thereafter released.</p> |
