| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that although Sn-(5 to 10)Sb (fusion point: 235 to 243°C) is generally known as high-temperature solder which is Pb-free solder, it is difficult to connect known Sn-Ag-Cu-based Pb-free solder at ≤235°C since the temperature is limited to 235°C for a layer with this composition and even when a connection can be made, solder of this kind is incapable of creep deformation even if having creep resistance and then has high residual stress to have a short temperature cycle life as #2 solder of a power module. <P>SOLUTION: For a method of making high reliability and a soldering process compatible with Pb-free layer solder, Sn-3Ag-0.5Cu-5In which can be connected at ≤240°C as Sn-(11 to 20)Sb low-temperature solder (solidus temperature: 246°C) is used as high-temperature solder. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
