| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in heat dissipation, flowability, and soldering resistance and can significantly suppress the change of a warp in each step to which a semiconductor device is subjected by the time it is mounted in a printed circuit board, and to provide a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition used for sealing a semiconductor device comprises an epoxy resin (A), a phenol resin-based curing agent (B), an inorganic filler (C) and a release agent (D), wherein the phenol resin-based curing agent (B) comprises a triphenol-methane type phenol resin; the inorganic filler (C) comprises spherical alumina; and the release agent (D) comprises a glycerol trifatty acid ester. <P>COPYRIGHT: (C)2009,JPO&INPIT |
