| 摘要 |
<p>912,460. Semi-conductor rectifiers. STANDARD TELEPHONES & CABLES Ltd. Sept. 1, 1961 [Sept. 8, 1960], No. 31546/61. Class 37. A semi-conductor wafer 4 of silicon, germanium, or an intermetallic compound, with a PN junction is soldered with lead 3 between the flattened ends 2 of solid silver or copper wires 1 which form the lead-in conductors. The wafer may be soldered in a butt joint, Fig. 3, or in a lap joint, Fig. 6. After being joined the rectifier may be dipped in hydrochloric acid to coat the lead with lead chloride after which the exposed edge of the wafer is etched. The wafer is then sealed in lacquer 5. The soldering may be effected by placing a lead disc on either side of the wafer, sandwiching the pile between the conductors and heating the assembly. As shown in Fig. 7 the rectifier is sealed in a ceramic tube 6 with inset washers 10 to avoid contamination of the device when resinous or solder seals 7 are made at each end. As shown in Fig. 8 a sleeve with cooling fins 9 may be attached to one end of the tube 6 to dissipate heat. Specification 850,599 is referred to.</p> |
