发明名称 |
Header assembly for implantable medical devices |
摘要 |
<p>A header assembly for an implantable medical device (IMD). The header assembly includes a plurality of cavities with a plurality of insulating rings interdisposed between adjacent ones of the cavities. The cavities receive electrical contact rings. In certain embodiments, the insulating rings are formed integrally with a body of the header assembly.</p> |
申请公布号 |
EP2228096(B1) |
申请公布日期 |
2012.07.11 |
申请号 |
EP20100002416 |
申请日期 |
2010.03.09 |
申请人 |
BAL SEAL ENGINEERING, INC. |
发明人 |
DILMAGHANIAN, FARSHID |
分类号 |
A61N1/375;H01R24/58;H01R13/187;H01R24/28;H01R105/00 |
主分类号 |
A61N1/375 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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