发明名称 |
Circuit board, electronic device and method for manufacturing the same |
摘要 |
A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough. |
申请公布号 |
US8217280(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US201113017544 |
申请日期 |
2011.01.31 |
申请人 |
SEKINE SHIGENOBU;SEKINE YURINA;KUWANA YOSHIHARU;NAPRA CO., LTD. |
发明人 |
SEKINE SHIGENOBU;SEKINE YURINA;KUWANA YOSHIHARU |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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