MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A multilayer printed circuit board and a manufacturing method thereof are provided to obtain junction reliability of an inter-layer circuit layer by electrically interlinking circuit layers formed on a plurality of insulation layers. CONSTITUTION: A first insulation layer(130) is formed at one side of a base substrate. A second insulation layer is formed at the other side of the base substrate. A first via-hole(150) passes through the first insulation layer and is extended to the center plane of the base substrate. A first via is formed by plating an inner wall of the first via hole. A second via hole(160) passes through the second insulation layer and is extended to the center plane of the base substrate. The second via hole contacts with the first via hole at the center plane of the base substrate. A second via is formed by plating an inner wall of the second via hole.