| 摘要 |
The invention relates to the devices and methods of one-sided abrasive processing semiconductor wafers based on the single-disc polishing machines, and can be used in microelectronics, semiconductor manufacturing, production of ultrasonic devices, in nanotechnology. A method of processing wafers consists in placing and securing workpieces on a bearing surface of a grinding faceplate symmetrically to its axle of rotation, which is eccentrically placed on a polisher, and through a frictional connection of the parts secured on the grinding faceplate with the working surface of polisher is set in rotation, and the parts are machined with periodic feeding a polishing suspension. The workpieces are secured on the bearing surface of grinding faceplate in a circular zone, whose diameters are in appropriate relations with the diameters of the working surface of polisher. An installation for implementation of the method comprises a polisher with a working surface installed in a horizontal plane on an axle of rotation, a grinding faceplate, on which bearing surface workpieces are placed and secured symmetrically to the axle of its rotation, and a bracket for eccentric placement of the grinding faceplate on the working surface of polisher with a corresponding value of eccentricity. The bearing surface of grinding faceplate has an annular grinding zone, the workpieces are secured on the bearing surface of grinding faceplate in the annular zone. Due to selection of the optimal ratios of geometric parameters of the polisher and grinding faceplate self-dressing is carried out of the surface of parts and polisher during processing, which improves the quality and accuracy of processing, shortens processing time and enhances the functionality of process equipment. |
