| 摘要 |
A harmonic suppression device includes a multilayer printed circuit board (PCB). The multilayer PCB includes a first layer, a second layer, and a third layer. The third layer is connected to the ground. The first layer is configured with a power amplifier, an input microstrip, a voltage divider microstrip, and an output microstrip. The power amplifier is operable to amplify radio frequency (RF) signals input using the input microstrip and to output the amplified RF signals using the output microstrip. The second layer is configured with a first microstrip and a second microstrip. One end of each of the first and second microstrips is connected to an alternative one of the first layer and the third layer by vias, and the other ends of the first and second microstrips are unattached so as to suppress harmonics on the power amplifier. |
