| 摘要 |
A multilayered wiring board is composed of n wiring layers and (n−1) resin base material layers, which are alternately laminated. The (n−1) resin base material layers include fiber bundles impregnated with resin. The n wiring layers include wiring patterns and resin. When half of the wiring layers in the thickness direction of the multilayered wiring board differ in the copper remaining ratio from the other half, the multilayered wiring board might be warped during heating. The crossing point density of fiber bundles in each resin base material layer is adjusted so as to cancel the warpage caused by the difference in the copper remaining ratio between the wiring layers. |
