发明名称 LIGHT-EMITTING PACKAGE AND LIGHTING DEVICE
摘要 PURPOSE: A light emitting package and a lighting device are provided to omit a separate secondary optical system for controlling a directional angle by including a plurality of molding units having different curvature. CONSTITUTION: A plurality of LED chips(100, 200, 300) is mounted on a lower substrate(500). A plurality of molding units(110, 210, 310) solders the plurality of LED chips. The plurality of molding units has different curvature. The curvature of a molding unit of an LED chip arranged on a center portion is lower than the curvature of a molding unit of an LED chip arranged on a peripheral portion. The plurality of LED chips comprises a blue LED chip in which a fluorescent substance layer of yellow series is formed.
申请公布号 KR20120077253(A) 申请公布日期 2012.07.10
申请号 KR20100139147 申请日期 2010.12.30
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 KIM, EUN JU;YE, KYUNG HEE
分类号 H01L33/52 主分类号 H01L33/52
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