发明名称 |
LIGHT-EMITTING PACKAGE AND LIGHTING DEVICE |
摘要 |
PURPOSE: A light emitting package and a lighting device are provided to omit a separate secondary optical system for controlling a directional angle by including a plurality of molding units having different curvature. CONSTITUTION: A plurality of LED chips(100, 200, 300) is mounted on a lower substrate(500). A plurality of molding units(110, 210, 310) solders the plurality of LED chips. The plurality of molding units has different curvature. The curvature of a molding unit of an LED chip arranged on a center portion is lower than the curvature of a molding unit of an LED chip arranged on a peripheral portion. The plurality of LED chips comprises a blue LED chip in which a fluorescent substance layer of yellow series is formed. |
申请公布号 |
KR20120077253(A) |
申请公布日期 |
2012.07.10 |
申请号 |
KR20100139147 |
申请日期 |
2010.12.30 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KIM, EUN JU;YE, KYUNG HEE |
分类号 |
H01L33/52 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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