发明名称 |
Cluster tool architecture for processing a substrate |
摘要 |
Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.
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申请公布号 |
US8215262(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US20080254784 |
申请日期 |
2008.10.20 |
申请人 |
ISHIKAWA TETSUYA;ROBERTS RICK J.;ARMER HELEN R.;VOLFOVSKI LEON;PINSON JAY D.;RICE MICHAEL;QUACH DAVID H.;SALEK MOHSEN S.;LOWRANCE ROBERT;BACKER JOHN A.;WEAVER WILLIAM TYLER;CARLSON CHARLES;WANG CHONGYANG;HUDGENS JEFFREY;HERCHEN HARALD;LU BRIAN;APPLIED MATERIALS, INC. |
发明人 |
ISHIKAWA TETSUYA;ROBERTS RICK J.;ARMER HELEN R.;VOLFOVSKI LEON;PINSON JAY D.;RICE MICHAEL;QUACH DAVID H.;SALEK MOHSEN S.;LOWRANCE ROBERT;BACKER JOHN A.;WEAVER WILLIAM TYLER;CARLSON CHARLES;WANG CHONGYANG;HUDGENS JEFFREY;HERCHEN HARALD;LU BRIAN |
分类号 |
B05C13/02;C23C14/00;H01L21/677 |
主分类号 |
B05C13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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