发明名称 Cluster tool architecture for processing a substrate
摘要 Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.
申请公布号 US8215262(B2) 申请公布日期 2012.07.10
申请号 US20080254784 申请日期 2008.10.20
申请人 ISHIKAWA TETSUYA;ROBERTS RICK J.;ARMER HELEN R.;VOLFOVSKI LEON;PINSON JAY D.;RICE MICHAEL;QUACH DAVID H.;SALEK MOHSEN S.;LOWRANCE ROBERT;BACKER JOHN A.;WEAVER WILLIAM TYLER;CARLSON CHARLES;WANG CHONGYANG;HUDGENS JEFFREY;HERCHEN HARALD;LU BRIAN;APPLIED MATERIALS, INC. 发明人 ISHIKAWA TETSUYA;ROBERTS RICK J.;ARMER HELEN R.;VOLFOVSKI LEON;PINSON JAY D.;RICE MICHAEL;QUACH DAVID H.;SALEK MOHSEN S.;LOWRANCE ROBERT;BACKER JOHN A.;WEAVER WILLIAM TYLER;CARLSON CHARLES;WANG CHONGYANG;HUDGENS JEFFREY;HERCHEN HARALD;LU BRIAN
分类号 B05C13/02;C23C14/00;H01L21/677 主分类号 B05C13/02
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