发明名称 |
Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium |
摘要 |
A plasma etching method etches an organic film formed on a target substrate by using a plasma of a processing gas via a silicon-containing mask. The processing gas is a gaseous mixture of an oxygen-containing gas, a rare gas and a carbon fluoride gas. A computer-executable control program controls a plasma etching apparatus to perform the plasma etching method. A computer-readable storage medium stores therein a computer-executable control program. |
申请公布号 |
US8216485(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US20080023620 |
申请日期 |
2008.01.31 |
申请人 |
KON YOSHIMITSU;HAYAKAWA YOSHINOBU;TOKYO ELECTRON LIMITED |
发明人 |
KON YOSHIMITSU;HAYAKAWA YOSHINOBU |
分类号 |
B44C1/22;H01L21/302 |
主分类号 |
B44C1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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