发明名称 Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium
摘要 A plasma etching method etches an organic film formed on a target substrate by using a plasma of a processing gas via a silicon-containing mask. The processing gas is a gaseous mixture of an oxygen-containing gas, a rare gas and a carbon fluoride gas. A computer-executable control program controls a plasma etching apparatus to perform the plasma etching method. A computer-readable storage medium stores therein a computer-executable control program.
申请公布号 US8216485(B2) 申请公布日期 2012.07.10
申请号 US20080023620 申请日期 2008.01.31
申请人 KON YOSHIMITSU;HAYAKAWA YOSHINOBU;TOKYO ELECTRON LIMITED 发明人 KON YOSHIMITSU;HAYAKAWA YOSHINOBU
分类号 B44C1/22;H01L21/302 主分类号 B44C1/22
代理机构 代理人
主权项
地址