WAFER CUTTING METHOD AND SYSTEM USING LASER BEAM

摘要

PURPOSE: A wafer cutting method and system using a laser beam are provided to obtain uniform cut profiles by moving a wafer orthogonally at 45 degrees to the projection direction of a laser. CONSTITUTION: A wafer cutting method is as follows. A wafer is cut by the projection of a laser beam with an oval type focus having a long x-axis and a short y-axis. The angle between the long and short axes of the laser beam and X and Y axes of wafer cutting lines is 45 degrees. The X and Y axes meet each other at the right angle. The laser beam is projected along the X axis to cut the wafer and then the wafer is rotated by 90 degrees to cut the wafer along the Y axis.