发明名称 Surface acoustic wave package with air hole that prevents thermal expansion
摘要 A surface acoustic wave device includes a surface acoustic wave (SAW) chip, a base that is made of resin and surround the SAW chip, and a cap that is made of resin and is bonded, by a seal member, to the base so as to define a cavity in which the SAW chip is sealed with the cap and the base, the cavity communicating with an outside of the surface acoustic wave device through a through hole formed in the seal member.
申请公布号 US8217551(B2) 申请公布日期 2012.07.10
申请号 US20090576863 申请日期 2009.10.09
申请人 MATSUO HIROSHI;TAIYO YUDEN CO., LTD. 发明人 MATSUO HIROSHI
分类号 H01L41/04;H01L41/08;H03H9/25 主分类号 H01L41/04
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