发明名称 Semiconductor constructions
摘要 In some embodiments, an opening is formed through a first material, and sidewall topography of the opening is utilized to form a pair of separate anisotropically etched spacers. The spacers are utilized to pattern lines in material underlying the spacers. Some embodiments include constructions having one or more openings which contain steep sidewalls joining to one another at shallow sidewall regions. The constructions may also contain lines along and directly against the steep sidewalls, and spaced from one another by gaps along the shallow sidewall regions.
申请公布号 US8217465(B2) 申请公布日期 2012.07.10
申请号 US20100852100 申请日期 2010.08.06
申请人 DEBRULER LEE;MICRON TECHNOLOGY, INC. 发明人 DEBRULER LEE
分类号 H01L29/76;H01L29/94;H01L31/062 主分类号 H01L29/76
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