| 摘要 |
<p>PURPOSE: A polymerizable photoacid generator compound is provided to have low outgassing property, and to have sensitivity to chemical ray radiation in case the compound is used for a photoresist composition exposed to radiation for advanced lithography. CONSTITUTION: A polymerizable photoacid generator compound is in chemical formula 1. In chemical formula 1, Q is a halogenated or non-halogenated C2-30 olefin-containing group, A is a fluorine-substituted C1-30 alkylene group, a fluorine-substituted C3-30 cycloalkylene group, a fluorine-substituted C6-30 arylene group, or a fluorine-substituted C7-30 alkylene-arylene group, Z is an anionic group containing sulfonate, sulfonamide, or sulfonimide, and G+ is in chemical formula 2. In chemical formula 2, R0 is a halogenated or non-halogenated combination independently comprising at least one of a C1-30 alkyl group, a polycyclic or monocyclic C3-30 cycloalkyl group, a polycyclic or monocyclic C4-30 aryl group. In case X is S, R0 is randomly attached to one nearby R0 group by a single bond, and a is 2 or 3. In case X is I, a is 2, and in case X is S, a is 3.</p> |
