发明名称 |
Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package |
摘要 |
A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.
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申请公布号 |
US8217115(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US20070446901 |
申请日期 |
2007.10.30 |
申请人 |
MASUDA TAKESHI;OKUBO HIKARU;SUMITOMO BAKELITE COMPANY, LTD |
发明人 |
MASUDA TAKESHI;OKUBO HIKARU |
分类号 |
C08L63/00;C08L63/04 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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