发明名称 Backside controlled MEMS capacitive sensor and interface and method
摘要 Described herein is the sense element assembly for a capacitive pressure sensor and method for creating same that has increased sensitivity despite the parasitic capacitance that is created. The capacitive sensor element assembly, comprises a first semiconductive layer, and a first conductive layer, a first dielectric layer into which a cavity has been formed, the dielectric layer lying between the first semiconductive layer and the first conductive layer, wherein an electrical connection is made to the second conductive layer. A preferred method for fabricating a capacitive sensor assembly of the present invention comprises the steps of forming a dielectric layer on top of a conductive handle wafer; creating at least one cavity in the dielectric layer, bonding a thin semiconductive layer to the dielectric layer and connecting an operational amplifier to the input of the capacitive sensor assembly to overcome the parasitic capacitance formed during fabrication.
申请公布号 US8217475(B2) 申请公布日期 2012.07.10
申请号 US20080121070 申请日期 2008.05.15
申请人 SEESINK PETER;ABED OMAR;CUSTOM SENSORS & TECHNOLOGIES, INC. 发明人 SEESINK PETER;ABED OMAR
分类号 H01L29/94 主分类号 H01L29/94
代理机构 代理人
主权项
地址