发明名称 Power semiconductor device
摘要 According to one embodiment, a power semiconductor device includes an IGBT region, first and second electrodes, and a first conductivity-type second semiconductor layer. The region functions as an IGBT element. The first electrode is formed in a surface of a second conductivity-type collector layer opposite to a first conductivity-type first semiconductor layer in the region. The second electrode is connected onto a first conductivity-type emitter layer and a second conductivity-type base layer in a surface of the first conductivity-type base layer and insulated from a gate electrode in the region. The first conductivity-type second semiconductor layer extends from the surface of the first conductivity-type base layer to the first conductivity-type first semiconductor layer around the IGBT region, and connected to the first electrode.
申请公布号 US8217420(B2) 申请公布日期 2012.07.10
申请号 US20100852193 申请日期 2010.08.06
申请人 OGURA TSUNEO;KABUSHIKI KAISHA TOSHIBA 发明人 OGURA TSUNEO
分类号 H01L29/43 主分类号 H01L29/43
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