| 摘要 |
PURPOSE: An epoxy resin composition for sealing semiconductor device is provided to have excellent flame retardance, moldability, and reliability by applying boehmite which is non-halogen type flame retardant with excellent thermal stability and reliability. CONSTITUTION: An epoxy resin composition for sealing semiconductor device comprises 2-15 weight% of epoxy resin, 0.5-12 weight% of a hardener, 0.01-2 weight% of a curing accelerator, 70-95 weight% of inorganic filler, and flame retardant, and comprises 0.1-20 weight% of boehmite in chemical formula 1: AlO(OH) as the flame retardant. The average particle diameter of the boehmite is 0.1-10 micron. The inorganic filler comprises silica. The weight ratio of the boehmite and the silica is 1:3-1:900. |
