发明名称 STRUCTURE ADHESIVE PAD OF STICKER TYPE
摘要 <p>PURPOSE: A sticker type structure adhesive pad is provided not to be attached with a hand of a worker, or peripheral components and to be able to prevent contamination by foreign material, etc. CONSTITUTION: A sticker type structure adhesive pad(100) comprises a hot melt adhesive layer(10) in which a release paper(11) is attached to one side, and a protective film(50) formed on the other side of the hot melt adhesive layer for reducing adhesion. The protective film comprises an epoxy based-hotmelt coating film. The protective film is melt-absorbed to the hot melt adhesive layer, and the protective film is formed to the thickness of about 30 micron.</p>
申请公布号 KR20120076044(A) 申请公布日期 2012.07.09
申请号 KR20100138014 申请日期 2010.12.29
申请人 SUNG WOO HITECH CO., LTD. 发明人 LEE, MUN YONG;KANG, HAK SU
分类号 C09J7/02;B32B37/12;C09J163/00;G09F3/00 主分类号 C09J7/02
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