发明名称 |
STRUCTURE ADHESIVE PAD OF STICKER TYPE |
摘要 |
<p>PURPOSE: A sticker type structure adhesive pad is provided not to be attached with a hand of a worker, or peripheral components and to be able to prevent contamination by foreign material, etc. CONSTITUTION: A sticker type structure adhesive pad(100) comprises a hot melt adhesive layer(10) in which a release paper(11) is attached to one side, and a protective film(50) formed on the other side of the hot melt adhesive layer for reducing adhesion. The protective film comprises an epoxy based-hotmelt coating film. The protective film is melt-absorbed to the hot melt adhesive layer, and the protective film is formed to the thickness of about 30 micron.</p> |
申请公布号 |
KR20120076044(A) |
申请公布日期 |
2012.07.09 |
申请号 |
KR20100138014 |
申请日期 |
2010.12.29 |
申请人 |
SUNG WOO HITECH CO., LTD. |
发明人 |
LEE, MUN YONG;KANG, HAK SU |
分类号 |
C09J7/02;B32B37/12;C09J163/00;G09F3/00 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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