发明名称 LED MODULE FOR LIGHTING HAVING ADVANCED RADIANT HEAT PERFORMANCE
摘要 PURPOSE: An LED module for illumination is provided to uniformly maintain the temperature of an LED by releasing heat transferred from a metal printed circuit board to outside through a heat radiation steel sheet. CONSTITUTION: An insulating layer(120) is arranged at the upper side of a metal printed circuit board(110). The insulating layer is a DLC(Diamond Like Carbon) coating layer having a hyaline component. The metal printed circuit board is composed of a magnesium material in which thermal conductivity is excellent. A circuit pattern(122) is formed on around a mounting hole(121). An LED cell(130) is installed is installed at the mounting hole. A heat radiation steel sheet(140) is arranged at the lower side of the metal printed circuit board. The heat radiation steel sheet releases heat transferred from the metal printed circuit board to outside.
申请公布号 KR20120074070(A) 申请公布日期 2012.07.05
申请号 KR20100136022 申请日期 2010.12.27
申请人 RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY 发明人 JUNG, WOO CHUL
分类号 F21V29/00;F21S2/00;F21Y101/02 主分类号 F21V29/00
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