| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which enables an aluminum member and a dissimilar metal material to be highly reliably soldered with each other without applying pretreatment such as plating to the aluminum member in solder bonding using the lead-free solder alloy, and which exhibits high reliability even when an electronic component is soldered with a conventional printed circuit board using the lead-free solder alloy. <P>SOLUTION: The soldering of extremely high reliability is attained in the soldering of an aluminum member with a dissimilar metal member, aluminum members with each other, and dissimilar metal members other than aluminum with each other without applying pretreatment such as plating to the members, by adding Sb or the like of, by weight, ≥1.5% and adding Sb of ≥1.5% and Ag of ≥3.0% to a lead-free solder alloy containing Sn-Cu-Ni as a basic composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
