| 摘要 |
A light emitting chip includes a substrate, an epitaxial structure comprising a first semiconductor layer, a light emitting layer and a second semiconductor layer, a current conducting structure formed on a bottom side of the first semiconductor layer of the epitaxial structure, and heat conducting protrusions formed on a top side of the substrate. Each of the heat conducting protrusions includes a carbon nanotube layer vertically grown thereon. The heat conducting protrusions are embedded into the current conducting structure to thermally connect with the first semiconductor layer. A method for manufacturing the light emitting chip is also disclosed.
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