发明名称 |
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD |
摘要 |
A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.
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申请公布号 |
US2012168205(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201213422909 |
申请日期 |
2012.03.16 |
申请人 |
HWANG JUN-OH;MOK JEE-SOO;PARK JUN-HEYOUNG;LEE KYUNG-AH;LEE EUNG-SUEK;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HWANG JUN-OH;MOK JEE-SOO;PARK JUN-HEYOUNG;LEE KYUNG-AH;LEE EUNG-SUEK |
分类号 |
H05K1/09;H05K1/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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