LIGHT EMITTING MODULE HAVING WAFER WITH INTEGRATED POWER SUPPLY DEVICE
摘要
A light emitting module is disclosed. The light emitting module comprises a wafer having first and second surfaces; a light emitting diode chip disposed on the first surface of the wafer; a power supply device for supplying power to the light emitting diode chip; and a photoelectric conversion device for converting sunlight into electricity and providing it to the power supply device, wherein the power supply device is disposed on the second surface of the wafer.
申请公布号
WO2012091245(A1)
申请公布日期
2012.07.05
申请号
WO2011KR06173
申请日期
2011.08.22
申请人
SEOUL SEMICONDUCTOR CO., LTD.;CHOI, HYUCK JUNG;YANG, YOUNG EUN