发明名称 Cooling Device for Diamond-Wire Cutting System
摘要 A cooling device for a diamond-wire cutting system includes a fluid retarding space as a cooling tank enclosed and defined by one or more surfaces for temporarily holding a cooling fluid. The surfaces provide a closed or semi-open sidewall that allows a cutting part of a diamond wire for cutting a workpiece to pass through the cooling tank and get immersed in the cooling fluid. A sorting collector is connected to the cooling tank. Thereby, cutting the hard-brittle workpiece is always performed in the cooling fluid, so as to prevent the cooling fluid and cutting chips from splashing, and improve heat dissipation and dust removal, thereby enhancing the cutting capability and efficiency. The tooled workpiece has cut surfaces with improved smoothness. The sorting collector performs solid-liquid separation to the cooling fluid containing cutting chips, so that the cutting chips and the cooling fluid can be recycled.
申请公布号 US2012167733(A1) 申请公布日期 2012.07.05
申请号 US201113038456 申请日期 2011.03.02
申请人 LEE CHENG MING;LEE PING FENG 发明人 LEE CHENG MING;LEE PING FENG
分类号 B26D7/08 主分类号 B26D7/08
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