| 摘要 |
PURPOSE: A method for manufacturing of a printed circuit board is provided to prevent the disproportion of plating by selectively electro-plating the interior of a pattern groove. CONSTITUTION: An insulating substrate is prepared. A first metal layer, an interlayer dielectric layer, and a second metal layer are successively formed on the insulating substrate. A plurality of circuit pattern grooves(111) is formed on the surface of the insulating substrate. A conductivity adsorption layer(120) is formed by adsorbing a conductive particle on the inner wall of the plurality of circuit pattern grooves. The conductive particle is a carbon particle. A circuit pattern(130) is formed by electro-plating the conductivity adsorption layer with a seed. The circuit pattern buries the plurality of circuit pattern grooves.
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