| 摘要 |
PURPOSE: An epoxy resin composition for sealing semiconductor device and a semiconductor device using the same are provided to improve reliability, moldability, and fire retardance. CONSTITUTION: An epoxy resin composition for sealing semiconductor device comprises an epoxy resin, a hardener, a plasticizer, and inorganic filler. The plasticizer includes benzoate ester based compound. The benzoate ester based compound comprises a compound marked as chemical formula 1. In the chemical formula 1, A and B are independently indicate H or C1-4 alkyl group. 0.01-5 weight% of the plasticizer is included based on the whole composition. A flexural modulus(ASTM D-790, 25°C) of the epoxy resin composition is 2230 - 2300.
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