| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, from which a cured film excellent in dry etching durability and transparency can be obtained. <P>SOLUTION: A photosensitive resin composition comprises: (component A) an alkali hardly soluble or alkali insoluble resin, the solubility of which with an alkali is increased by an action of an acid; (component B) a photoacid generator; (component C) a fluorene compound expressed by a formula (I); and (component D) a solvent. In the formula, R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>, R<SP POS="POST">3</SP>, R<SP POS="POST">4</SP>, R<SP POS="POST">5</SP>and R<SP POS="POST">6</SP>each independently represent a monovalent substituent; m, n, p and q each independently represent an integer from 0 to 4; at least one of R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>represents a monovalent organic group having an epoxy group, oxetanyl group, hydroxyl group, carboxyl group or ethylenically unsaturated group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
