| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic circuit device which eliminates a process in which a case is joined to a cover with laser welding and a process in which the case is bonded to the cover with an adhesive and improves the rigidity. <P>SOLUTION: An electronic circuit device includes a circuit board housed in an interior space SP formed by a metal case 101 and a cover 102. The case 101 and the cover 102 respectively has opposite surface parts 101A, 102A which face each other sandwiching the interior space SP and side surface parts 101B, 102B erected from the circumference of the opposite surface parts 101A, 102A. The cover 102 is fitted into the case 101 so that the side surface 102B gets into the inner side of the side surface part 101B of the case 101. The side surface part 102B of the cover 102 is fixed to the case 101 with a sealing resin 105 which fills the interior of the case 101 to seal the circuit board 103A and is cured. <P>COPYRIGHT: (C)2012,JPO&INPIT |
