发明名称 |
THREE DIMENSIONAL STACKED CHIP PACKAGE STRUCTURE |
摘要 |
This disclosure related to a stacked chip package structure having a sloped dam structure located on the substrate and beside the chip stack. The dam structure can facilitate the dispensing process of the underfill.
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申请公布号 |
US2012168967(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201113154423 |
申请日期 |
2011.06.06 |
申请人 |
HUANG YU-WEI;YANG TSUNG-FU;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HUANG YU-WEI;YANG TSUNG-FU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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