发明名称 |
Adjustable Capacitor, Plasma Impedance Matching Device, Plasma Impedance Matching Method, And Substrate Treating Apparatus |
摘要 |
Disclosed is a substrate treating apparatus which comprises a process chamber; an electrode configured to generate plasma from a gas supplied into the process chamber; an RF power supply configured to output an RF power; a transmission line configured to transmit the RF power to the electrode from the RF power supply; an impedance matching unit connected to the transmission line and configured to match plasma impedance; and a controller configured to output a control signal to the impedance matching unit, wherein the impedance matching unit comprises an adjustable capacitor having a plurality of capacitors and a plurality of switches corresponding to the plurality of capacitors, the plurality of switches being switched on/off according to the control signal so that capacitance of the adjustable capacitor is adjusted. |
申请公布号 |
US2012168081(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201113337878 |
申请日期 |
2011.12.27 |
申请人 |
SON DUKHYUN;SEMES CO., LTD. |
发明人 |
SON DUKHYUN |
分类号 |
H03H7/38;B44C1/22;H02M3/06;H05H1/24 |
主分类号 |
H03H7/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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