发明名称 OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin optical semiconductor device which can be manufactured conveniently using a sealing sheet, and exhibits a low chromaticity angle dependency, and to provide a method of manufacturing the same. <P>SOLUTION: The optical semiconductor device is manufactured using a sheet for sealing an optical semiconductor element which is formed by directly or indirectly laminating a sealing resin layer capable of embedding the optical semiconductor element and a wavelength conversion layer containing light wavelength conversion particles, arranging the sealing resin layer to face an optical semiconductor element mounting substrate, and then using a concave mold for molding. The area of the upper surface of a molding embedding the optical semiconductor element is in the range of 40% or more and 60% or less of the total area of the area of the upper surface and the area of the side surface of the molding. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012129362(A) 申请公布日期 2012.07.05
申请号 JP20100279497 申请日期 2010.12.15
申请人 NITTO DENKO CORP 发明人 OZAKI TAKASHI;AKAZAWA MITSUHARU;KONDO TAKASHI
分类号 H01L33/54;H01L23/28;H01L33/50 主分类号 H01L33/54
代理机构 代理人
主权项
地址