| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device manufacturing method, a highly reliable electronic device, an electronic device package manufacturing method and an electronic device package in which displacement of an electronic component does not occur, an encapsulation material and an electronic component are hard to be broken, and a residue can be easily removed even when the residue adheres, during a manufacturing process of a reconfigured electronic device. <P>SOLUTION: The electronic device manufacturing method of the present invention comprises a step of forming a fixing resin layer by supplying, on a surface of a support base material, a temporary fixing agent composed of a resin composition including a resin component melting or vaporizing due to thermal decomposition caused by heating and subsequently drying the temporary fixing agent, a step of fixing an electronic component, a step of forming an encapsulation material layer, a step of obtaining a cured encapsulation material for arranged electronic components and a step of peeling the cured encapsulation material for arranged electronic components from the support base material. In the step of forming the fixing resin layer, the fixing resin layer having viscosity at 200°C of 10 Pa s and over and 10000 mPa s and under is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
