| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a substrate with a built-in coil, which enables a surface undulation of the substrate with a built-in coil to be suppressed. <P>SOLUTION: An unbaked laminate comprises: a laminated unbaked ceramic base layer; unbaked coil elements overlapped each other in perspective view from a lamination direction; an unbaked interlayer connection conductor for connecting unbaked coil elements each other by penetrating the unbaked ceramic base layer; a disappearance layer formed between the unbaked ceramic base layer and the unbaked coil elements using material for forming cavity which disappears at a sintering temperature at which the unbaked ceramic base layer sinters. The cavities are formed when the unbaked laminate is baked as follows: (i) making only a portion of the material for forming cavity in the disappearance layer disappear during a first period in which a temperature is raised up to a shrinkage start temperature at which shrinkage of the unbaked ceramic base layer starts; (ii) continuing disappearance of the material for forming cavity in the disappearance layer during also a second period in which the shrinkage of the unbaked ceramic base layer has started by further raising the temperature. <P>COPYRIGHT: (C)2012,JPO&INPIT |
