发明名称 RESIN MOLD APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin mold machine in which, out of a series of works after molding a resin by inspecting a molding and heating and curing, only non-defective products are efficiently carried out by a compact apparatus structure, the warpage of the work does not occur and heat radiation is suppressed. <P>SOLUTION: A heating and curing section E in which a mold resin is heated and cured in a tightly closed curing furnace 43 as the work W after molding the resin is held by inserting a carrier plate K into a slit 43a formed at the curing furnace 43 is provided in a part of a work transporting path from a press C toward a work housing F. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012126076(A) 申请公布日期 2012.07.05
申请号 JP20100281470 申请日期 2010.12.17
申请人 APIC YAMADA CORP 发明人 FUJISAWA MASAHIKO;MURAMATSU YOSHIKAZU;MAEYAMA TETSUYA
分类号 B29C43/52;B29C43/18;H01L21/56 主分类号 B29C43/52
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