| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an epoxy resin composition for sealing a semiconductor in which a large size foreign metallic particle hardly mixes in. <P>SOLUTION: The method of manufacturing an epoxy resin composition for sealing a semiconductor includes: a process in which a raw material including an epoxy resin, a curing agent, and an inorganic filler is mixed, then is kneaded by a kneading apparatus 11 to obtain a kneaded product; a process in which the kneaded product is rolled into a sheet shape by a rolling roll 12 to obtain a rolled product; a process in which the rolled product is cooled in a cold gas while being conveyed by a cooling conveyor 13, and the rolled product (sheet) is cracked by a portion of an end of the cool conveyor 13 which cracks a sheet to obtain a cracked product; a process in which the cracked product is granulated by a grinder to obtain a granulated product; a process to catch magnetic metals; a process to pressure-mold the granulated product in which the magnetic metals have been caught to be removed, wherein in an endless chain in which the cooling conveyer 13 is parallelly arranged at an endless chain side of a mesh like endless net, a partition plate is arranged at an inside vicinity of the endless chain. <P>COPYRIGHT: (C)2012,JPO&INPIT |
