| 摘要 |
A cooling device for electronic components (C) comprises a substantially prismatic body (2) made of a thermally conductive material, which has a pair of substantially planar main outer surfaces (3, 4) and encloses therein at least one circuit (5) for the flow of a cooling fluid (F). Both main outer surfaces (3, 4) are designed to allow removable attachment of an electronic component (C) to be cooled. A control apparatus incorporating the device. |
