| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board in which transmission speed of thermal energy of an electronic component can be increased. <P>SOLUTION: The circuit board comprises: a circuit layer; a heat conduction plate; and an insulation layer. The heat conduction plate comprises: a plate body having a plate surface; and at lest one bump extending from the plate surface to be connected with a projection plate. The bump has a top face, and a side face surrounding and connecting the circumference of the top face. The side face connects the top face and the plate surface. The insulation layer is arranged on the plate surface, and comes into contact with the side face, thus exposing the top face. The circuit layer is arranged on the insulation layer and insulated from the bump electrically. <P>COPYRIGHT: (C)2012,JPO&INPIT |
