| 摘要 |
A light emitting diode (LED) package and the manufacturing method thereof are provided. The LED package comprises a substrate, at least one LED die, a lens and an in-mold decoration film, wherein the LED die is fixed on the substrate; the lens is convexly molded on the substrate to encapsulate the LED die; and the in-mold decoration film has at least one phosphor layer disposed on the lens and a surface treatment layer disposed on the phosphor layer.
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