发明名称 HOUSING FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 A method of manufacturing a housing includes steps of providing a transparent film including a first surface and an opposing second surface; applying adhesive material on the first surface of the transparent film; placing the treated transparent film in a mold, the second surface of the transparent film attached to the inner molding surface of the mold. Plastic material is injected into the mold to form a plastic base overlaid with the transparent film; and defining a predetermined decorative pattern in a top portion of the plastic base beneath the adhesive layer using a laser etching process. The decorative pattern cannot be sensed by touch rough because it is located between the plastic base and the cover layer.
申请公布号 US2012168339(A1) 申请公布日期 2012.07.05
申请号 US201113223172 申请日期 2011.08.31
申请人 JAN TE-SHENG;CHEN YU-TAO;YEN CHUN-CHE;LIU JIAN-MING;LIU DE-HUA;HON HAI PRECISION INDUSTRY CO., LTD.;HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD 发明人 JAN TE-SHENG;CHEN YU-TAO;YEN CHUN-CHE;LIU JIAN-MING;LIU DE-HUA
分类号 B65D79/00;B29C45/14 主分类号 B65D79/00
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