发明名称 ITO SPUTTERING TARGET AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an ITO sputtering target which is high in density, comprised of an ITO sintered compact having a low tin oxide content, can form an ITO thin film of high crystallinity, and can form the stable film over a long time. <P>SOLUTION: As raw material powder, there are used indium oxide powder having 3-15 m<SP POS="POST">2</SP>/g of a specific surface area value and 0.1-0.5 &mu;m of an average particle diameter, and tin oxide powder having 10-15 m<SP POS="POST">2</SP>/g of a specific surface area value and 0.1-1.5 &mu;m of an average particle diameter, and the content of a tin oxide is adjusted to a range of 2.5-5.2 mass%. They are mixed and crushed, and press-formed at a pressure of 196 MPa or higher and calcined in an oxygen atmosphere of normal pressure under the condition that a temperature increase rate is 1.0-5.0&deg;C/minute in a region of 1,000&deg;C or higher, a retention temperature is 1,500-1,600&deg;C and a retention time is 20-30 hours to set the average density of the obtained ITO sputtering target at 7.1 g/cm<SP POS="POST">3</SP>, and the average crystal grain diameter at 3 &mu;m or larger and smaller than 10 &mu;m. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012126937(A) 申请公布日期 2012.07.05
申请号 JP20100277493 申请日期 2010.12.13
申请人 SUMITOMO METAL MINING CO LTD 发明人 SATO KEIICHI
分类号 C23C14/34;C04B35/00 主分类号 C23C14/34
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