发明名称 |
Lens module for lens wafer module used in camera module unit, has locking element which is installed in receiving groove formed in surface of lens, and is incident to the lens assembly |
摘要 |
<p>The lens module (20) has a lens assembly which comprises several lenses (21,22) that are arranged on an optical axis following each other. A receiving groove (21c) is formed in the surface of the lens. A locking element (25) is installed in the receiving groove and is incident to the lens assembly. The depth of the receiving groove corresponds to thickness of the locking element. An independent claim is included for lens wafer module.</p> |
申请公布号 |
DE102011006140(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
DE20111006140 |
申请日期 |
2011.03.25 |
申请人 |
SAMSUNG ELECTRO - MECHANICS CO., LTD. |
发明人 |
HAN, JOON HYUK |
分类号 |
G02B7/00;G02B3/00;G02B13/00 |
主分类号 |
G02B7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|